Institute of Microelectronics

M.Sc. David-Peter Wiens

I studied electrical engineering at the University of Ulm, where i received my B.Sc degree in December 2019 and my M.Sc. degree in May 2022.  The topic of my Master thesis was "Feedback-Assisted linearization of a Gm-C based CTDS-Modulator for Neuromodulation".

Since July 2022 I am working towards my Ph.D. degree at the Institute of Microelectronics at the University of Ulm under the supervision of Prof. Dr.-Ing. Maurits Ortmanns. My current research interest is in the field of low-noise current sensing front-ends.

Student theses

[mt] = Master theses, [rp] = Bachelor theses

Past theses

  • Bernhard Lachenmaier
    Design and Implementation of a Digital Differentiator [rp]

Publications

2025

8.
D. -. Wiens, A. Abdelaal, B. Driemeyer, J. Becker, J. G. Kauffman and M. Ortmanns, "A Direct Digitizing, 1MHz Bandwidth, 28fA/√Hz Current Sensing Front-End Based on a Mixed-Signal Integrator-Differentiator TIA in 28nm CMOS", IEEE Custom Integrated Circuits Conference (CICC), Boston, MA, USA, Apr. 2025.
DOI:10.1109/CICC63670.2025.10983397
7.
B. Driemeyer, H. Mandry, D. -. Wiens, J. Becker, J. G. Kauffman and M. Ortmanns, "17.5 An Eye-Opening Arbiter PUF for Fingerprint Generation Using Auto-Error Detection for PVT-Robust Masking and Bit Stabilization Achieving a BER of 2e-8 in 28nm CMOS", IEEE International Solid-State Circuits Conference (ISSCC), San Francisco, CA, USA, Feb. 2025.

2024

6.
D. -. Wiens, B. Driemeyer and M. Ortmanns, "A Mixed-Signal TIA with Input Restoring ADC", IEEE International Symposium on Circuits and Systems (ISCAS), Singapore, May 2024.
DOI:10.1109/ISCAS58744.2024.10557979
5.
P. Kässer, O. Ismail, D. -. Wiens and M. Ortmanns, "Offset Cancellation in Incremental ∆Σ ADCs", IEEE International Symposium on Circuits and Systems (ISCAS), Singapore, May 2024.
DOI:10.1109/ISCAS58744.2024.10557952
4.
B. Driemeyer, H. Mandry, D. -. Wiens, J. Becker and M. Ortmanns, "Optimisation of RO-PUF Design Parameters for Minimising the Effective Area per PUF Bit", IEEE International Symposium on Circuits and Systems (ISCAS), Singapore, May 2024.
DOI:10.1109/ISCAS58744.2024.10558478

2023

3.
B. Driemeyer, P. Kässer, H. Mandry, D. -. Wiens and M. Ortmanns, "A Feasibility Study on a Switched-Capacitor Based PUF in 28 nm Technology", 30th IEEE International Conference on Electronics, Circuits and Systems (ICECS), Istanbul, Turkiye, Dec. 2023.
DOI:10.1109/ICECS58634.2023.10382899
2.
D. -. Wiens, M. Sporer, B. Driemeyer and M. Ortmanns, "A Mixed-Signal Integrator-Differentiator-TIA", IEEE Transactions on Circuits and Systems--II: Express Briefs, Sep. 2023.
DOI:10.1109/TCSII.2023.3318725

2022

1.
B. Driemeyer, H. Mandry, D. -. Wiens, J. Becker and M. Ortmanns, "PUF-Entropy Extraction of DAC Intersymbol-Interference using Continuous-Time Delta-Sigma ADCs", IEEE International Conference on Electronics, Circuits and Systems (ICECS), Oct. 2022.
DOI:10.1109/ICECS202256217.2022.9971072

Research Assistent

David-Peter Wiens