Institute of Microelectronics

M.Sc. Dominik Fritschi

Dominik Fritschi received the B.Sc. and M.Sc. degrees in electrical engineering from the University of Ulm in 2021 and 2024, respectively. In his Bachelor Thesis and as a student assistant, he worked in the field of neuromodulators. The topic of his master thesis was "Design of ADCs in fineline CMOS at cryogenic temperatures".
From April to October 2023, he worked as an intern in the custom design automation team at Qualcomm Technologies Inc. (Cork, Ireland). Since September 2024, he is working towards his Ph.D. at the Institute of Microelectronics under the supervision of Prof. Dr.-Ing. Maurits Ortmanns.

Student theses

[mt] = Master thesis, [rp] = Bachelor thesis

Current theses

  • J D
    Development of a Miniaturized PCB for a Wireless Neuromodulator Headstage [rp]
  • Tim Tobias Pallas
    Implementation of a Stimulation Artifact Tolerance Technique for Neural Recording [mt]

Publications

2025

4.
M. Sporer, D. Fritschi, N. Graber, S. Reich and M. Ortmanns, "A Wireless Headstage Based on a 32-Channel Neuromodulator Integrated Circuit", IEEE International Symposium on Circuits and Systems (ISCAS), London, United Kingdom, May 2025.
DOI:10.1109/ISCAS56072.2025.11043699

2023

3.
S. Reich, D. Fritschi, M. Sporer and M. Ortmanns, "In Vitro Study of Artifact-Recovery Using a 32-Channel Neuromodulator Platform", IEEE Transactions on Circuits and Systems I: Regular Papers (Early Access), Mar. 2023.
DOI:10.1109/TCSI.2023.3255549

2022

2.
S. Reich, D. Fritschi, M. Sporer and M. Ortmanns, "Artifact-Recovery in Neuromodulators using Tunable High-Pass Corners", 20th IEEE International NEWCAS Conference, Québec, Canada, Jun. 2022.
1.
S. Reich, D. Fritschi, M. Sporer and M. Ortmanns, "An Experimental Reliability Study of Pseudo-Resistors in Biomedical Applications", IEEE International Symposium on Circuits and Systems (ISCAS), Austin, TX, USA, May 2022.

Research Assistent

Dominik Fritschi