Peripherical technology
Processing
- Grinding (Franz Amman)
- Polishing (Logitech PM2A)
- Dicing (Tempress 602)
- H2-Oxidation
- Alloying (Biorad)
Mounting
- DIE bonding
- Wire bonding
- Flip-Chip bonding
- Spot welding
Charakterisation
- Photoluminescence
- X-ray diffractometer (Philips)
- SEM (Zeiss Leo 982)
- AFM (DI D3100SPM)
- Halleffect (Bruker)
- Reflection spektrometry
- RF equipment
- Signal Analysis (Tektronik CSA 8563E)