© Elvira Eberhardt/Universität Ulm

GeMiC moved to 2022

Due to the current COVID-19 situation we decided to move the GeMiC 2021 by one year. A detailed statement can be read here.
Future informations will be published on www.gemic2022.de.

Accepted papers will be considered for publication in IEEE Xplore. Abstracts (max. 4 pages A4) should be submitted electronically as described on the official conference webpage.

Call For Papers

You can download the PDF by clicking here.

The following technical areas are covered:

Electronics and Active Circuits
  • Low Noise and Power Amplifiers
  • Frequency Synthesis, Conversion, and Control Circuits
  • Microwave, Millimeter-Wave, and THz Devices
  • Microwave Photonic Components, Circuits and Systems
  • Transmitter and Receiver Circuits
  • Frontends and Transceiver Modules
  • System-on-Chip / System-in-Package
  • Microwave Tubes
Passives, EM, and Antennas
  • Planar and Non-Planar Passive Components
  • Additive Manufacturing and Emerging Materials
  • Interconnects, Packaging, and System-in-Package Technologies
  • Metamaterials and Frequency Selective Surfaces
  • Antennas and Antenna Arrays
  • Integrated Antennas
  • Electromagnetic Field Theory and Numerical Techniques
  • Electromagnetic Compatibility, Interference, and Signal Integrity

Systems and Sensors

  • Microwave, Millimeter-Wave, and THz Sensors
  • Communication Systems
  • Radar Imaging and Localization Systems
  • Radar Modelling and Processing
  • Measurement and Calibration Techniques
  • Material Testing and Characterization
  • Cognitive Radio Systems
  • Biomedical Applications