NVision 40 Ar

  • Ga ion beam (2 - 30 kV) for nano structuring and cutting
  • Electron beam (0.5 - 30 kV) for imaging using inlens, SE2, BSE and other detectors
  • Gas injection system (GIS) to create nano-sized contacts, insulators and protection layers
  • EDX system for element analysis
  • 3D volume inspection by slice-and-view
  • TEM lamella sample preparation